Asia Express - East Asian ICT
Fullcomp to Build US$300 Mln Chip Plant in Beijing
March 10, 2006
Fullcomp, a holding company registered in Samoa, recently announced that it plans to set up a US$300 million semiconductor production facility in Beijing. Construction on the plant, which is said to receive strong support from the Beijing city government and the Linhe Industrial Development Zone, is expected to start in the coming months, and when construction will be finished, the plant is projected to have an initial production capacity of 30,000 eight-inch wafers per month. It will mainly engage in contract manufacturing for both Chinese and international companies. According to the Financial Times, Fullcomp did not reveal many details about its ownership, only mentioning that its main investors are overseas Chinese.